Power Semiconductor and Inverter Measurement Solutions Technical Examples

This document provides technical examples of high-precision measurement and inspection solutions for power semiconductors and inverters, focusing on thickness measurement of SiC wafers and wafers laminated with BG tape. It highlights the CL-3000 Series spectral-interference laser displacement meter and SI-F1000 Series confocal displacement sensor, emphasizing zero thermal influence, optical-axis alignment for error reduction, and ultra-high-resolution profile measurement using the LJ-X8000 Series 2D/3D laser profiler.