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VK-X Series 3D Surface Profiler Semiconductor Package Inspection Manual

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This document provides technical information and application examples for inspecting semiconductor and electronic component packages using the KEYENCE VK-X Series 3D Surface Profiler. It covers various package types (SIP, DIP, SOP, SOJ, QFP, QFJ, SON, QFN, BGA, PGA, LGA), wire bonding and flip-chip bonding processes, and bump making methods for quality control and pass/fail inspection.

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