MELSEC iQ-F I/O Modules Packaging Box Change Notice

This technical bulletin announces a change in the size and internal buffering structure of the packaging box for specific MELSEC iQ-F series I/O modules, including input, output, and high-speed pulse input/output models. The change, effective from December 2023, aims to improve packaging quality and includes updates to recycling codes and the addition of a two-dimensional code, with no impact on module specifications or performance.