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XR Series 3D Measurement and Inspection System Technical Description

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This document describes a 3D measurement and inspection system that uses structured light patterns projected via MEMS micro-mirror technology to capture height information for solder fillet and component inspection. It highlights key technologies including bidirectional light projection, multi-shot and one-shot HDR, outlier removal, and XY normalization, enabling stable inline inspection of complex workpieces with varying reflectivity.

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